information Advantages of 3ZTechnology / Innalabs Holding, Inc.

Advantages of 3ZTechnology

Perfect self-alignment of contact pad with via hole

4mm x 4mm
(total grid size)

α₁ = α₂ uBGA
(400 μm center line to center line)
∅ 200 µm via diameter
Minimal size of contact pad

α → approaching zero uBGA(0.35)
∅ 100 µm uBGA(0.15)
∅ 50 µm
Duplicating pattern without photomask
An opportunity to produce PCBs that can accommodate up-to-date electronic chips, as well as next generation chips.
Allows for reduction in the number of PCB layers, thus raising PCB reliability while lowering costs.
Allows for reduction in the number of PCB layers, thus increasing the yield from the existing manufacturing hardware and software.