information Summary / Innalabs Holding, Inc.

Summary

Innalabs 3ZTechnology is a process improvement technology that delivers higher density PCBs, using existing PCB manufacturing equipment.
3ZTechnology allows manufacturers to exactly align contact pads relative to holes, increase wire sections of conductors, and duplicate patterns without photomask.
This means that manufacturers can reduce hole diameter, reduce contact pad size by 1/3rd or more, reduce line width, increase PCB density by a factor of 3 or more, and increase accuracy of contact pad placement.
Innalabs 3ZTechnology significantly broadens possibilities of the standard technological processes, and of PCB manufacturing equipment.
Innalabs 3ZTechnology can be implemented in other fields where photoresists are used, such as microelectronic and micro-electromechanical systems (MEMS) etc.