Exact self-alignment of contact pads relative to holes, without photomask




Innalabs 3ZTechnology provides the capability to increase the PCB yield during normal manufacturing processes

Standard Technology Registration errors are possible Microvia Ø 200 µm Contact pad diameter 360 µm

Innalabs 3ZTechnology Perfect self-alignment Microvia Ø 200 µm Contact pad diameter 290 µm. Can be reduced further, and can approach 200 µm in this example

Reduce the diameter of holes, and reduce size of contact pads

Reduction in contact pad diameter by 1/3rd or more is achievable

Standard Technology Registration errors are common

Innalabs 3ZTechnology Perfect self-alignment

Increase Density – contact pads are smaller and lines are narrower

Increase in density by a factor of 3 or more is achievable

Standard Technology 6-layer PCB

Innalabs 3ZTechnology The same 2-layer PCB. Increase the density of microvia and lines by a factor of 3 times.

Utilize Duplicating Pattern without photomask

Increase in ratio of wire section conductors is achievable