3ZTechnology* is a highly innovative process improvement technology for producing higher density PCBs, using existing PCB manufacturing equipment.

3ZTechnology allows PCB manufacturers to achieve exact self-alignment of contact pads relative to holes, increased cross-sections of conductors, and duplication of patterns without photomask.

3ZTechnology is implemented through programming of existing production machines, using optimal processing parameters developed by 3ZTechnology.

• greatly reduce the size of the contact pad
• reduce the via hole diameter
• have a greater accuracy of contact pad placement
• reduce line width
• achieve this using the existing manufacturing equipment